Vertical metal scribe12/3/2023 ![]() H01L21/67- Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components Apparatus not specifically provided for elsewhere.H01L21/78- Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices.H01L21/77- Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate.H01L21/70- Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof Manufacture of integrated circuit devices or of parts thereof. ![]() H01L21/00- Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof. ![]() H01L- SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10.Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Assigned to FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment FAIRCHILD SEMICONDUCTOR CORPORATION RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 046530, FRAME 0494 Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Status Active legal-status Critical Current Adjusted expiration legal-status Critical Links Assignors: MICRO PROCESSING TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assigned to MICRO PROCESSING TECHNOLOGY, INC., SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment MICRO PROCESSING TECHNOLOGY, INC. Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). US case filed in Florida Middle District Court litigation Source: District Court Jurisdiction: Florida Middle District Court "Unified Patents Litigation Data" by Unified Patents is licensed under a Creative Commons Attribution 4.0 International License. US case filed in Arizona District Court litigation Source: District Court Jurisdiction: Arizona District Court "Unified Patents Litigation Data" by Unified Patents is licensed under a Creative Commons Attribution 4.0 International License. Priority to US13/136,459 priority Critical patent/US8450188B1/en Application filed by Micro Processing Technology Inc filed Critical Micro Processing Technology Inc Publication of US8450188B1 publication Critical patent/US8450188B1/en Application granted granted Critical US case filed in Florida Middle District Court litigation Source: District Court Jurisdiction: Florida Middle District Court "Unified Patents Litigation Data" by Unified Patents is licensed under a Creative Commons Attribution 4.0 International License. reassignment MCIRO PROCESSING TECHNOLOGY, INC. Assigned to MCIRO PROCESSING TECHNOLOGY, INC. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Family has litigation First worldwide family litigation filed litigation Critical (B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License. Original Assignee Micro Processing Technology Inc Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Active, expires Application number US13/136,459 Inventor Paul C. ![]() Google Patents Method of removing back metal from an etched semiconductor scribe streetĭownload PDF Info Publication number US8450188B1 US8450188B1 US13/136,459 US201113136459A US8450188B1 US 8450188 B1 US8450188 B1 US 8450188B1 US 201113136459 A US201113136459 A US 201113136459A US 8450188 B1 US8450188 B1 US 8450188B1 Authority US United States Prior art keywords metal layer support wafer semiconductor material scribe streets Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US8450188B1 - Method of removing back metal from an etched semiconductor scribe street US8450188B1 - Method of removing back metal from an etched semiconductor scribe street
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